Grinding & Dicing Services
Data Breach on November 14, 2025
| Data Breach Report | |||
|---|---|---|---|
| Victim | wafergrind.com | ||
| Threat Actor | INC_RANSOM | ||
| Date Discovered | Nov 14, 2025 | ||
| Description | Grinding & Dicing Services, Inc. is a wafer‑thinning, grinding and dicing service provider based in the USA, specializing in ultra‑thin wafer processing, back grinding, die preparation and MEMS-semiconductor support. | ||
| Leak Size | Unknown |
Is your organization next?
Grinding & Dicing Services was breached. Check if your company's credentials have been exposed in this or other data breaches.
Check your exposure →Running security for a team? See how continuous dark web monitoring alerts you when company credentials or session tokens show up.