Grinding & Dicing Services
Data Breach on November 14, 2025
| Data Breach Report | |||
|---|---|---|---|
| Victim | wafergrind.com | ||
| Threat Actor | INC_RANSOM | ||
| Date Discovered | Nov 14, 2025 | ||
| Description | Grinding & Dicing Services, Inc. is a wafer‑thinning, grinding and dicing service provider based in the USA, specializing in ultra‑thin wafer processing, back grinding, die preparation and MEMS-semiconductor support. | ||
| Leak Size | Unknown |
Credential Exposure for wafergrind.com
We've indexed 5 @wafergrind.com accounts from external breaches.
Last checked Aug 16, 2026
| @wafergrind.com addresses from external breaches | |
|---|---|
| Third-party breaches | 4 accounts · across 10 breaches · 4 with a plaintext password · most recent Dec 18, 2025 |
| Combo lists | 4 accounts · most recent Nov 25, 2025 |
None of this is necessarily connected to the ransomware attack above.
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