| Data Breach Report | |||
|---|---|---|---|
| Victim | wafergrind.com | ||
| Threat Actor | INC_RANSOM | ||
| Date Discovered | Nov 14, 2025 | ||
| Description | Grinding & Dicing Services, Inc. is a wafer‑thinning, grinding and dicing service provider based in the USA, specializing in ultra‑thin wafer processing, back grinding, die preparation and MEMS-semiconductor support. | ||
| Leak Size | Unknown |
Grinding & Dicing Services
Data Breach on November 14, 2025
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